TECNALIA invites you to participate in the VIII International Congress on Architectural Envelopes, ICAE 2018, which will be held from 20 to 22 June 2018 in Donostia – San Sebastian.

This latest edition will be the eighth and the approach aims to follow the format of the past two editions: a national and international forum enabling the most relevant aspects of the world of envelopes to be discussed whilst staying abreast of the latest developments in the sector through two different but complementary points of view:

• The latest advances, studies and developments from the point of view of R&D of universities, research centres and manufacturing firms
• Use of these advances in innovative buildings and envelopes and their direct impact on the market and in everyday life.

During the congress, we want to be able to provide this dual vision, the future and the developments that we envisage for the forthcoming years and the everyday life that we face in 2018.